A true success – on June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and was led off by three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.
Attendees at the inaugural 3D-PEIM
A highlight was Tuesday’s Plenary Road Mapping session chaired by Brian Narveson, PSMA, with three keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.
The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at VT, and CALCE at UMD. Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.
Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you have interest, please contact info@3D-PEIM.Org, or call the PSMA office at +1-973-543-9660.